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Jobs or company...

Senior Process Engineer, Edge Shaping

Salary undisclosed

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Dice

Availability Status

This job is expected to be in high demand and may close soon. We’ll remove this job ad once it's closed.

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Job Description

Job Description

The Opportunity

As Halo ramps up volume on its initial pilot production line, we are seeking a process engineer to help develop wafer fabrication processes to fill customer needs and maintain production processes for a variety of tools such as grinders, polishers and cleaning systems. This particular role will focus especially on equipment/processes for shaping the edges of wafers.

Job Description

As a senior process engineer, you will have the following responsibilities

  • Serve as the principal process engineer responsible for edge shaping at Halo Industries, including grinding equipment and related metrology
  • Determine process recipes and tool operating conditions in order to fulfill customer orders
  • Respond to customer feedback and identify opportunities for quality improvement
  • Conduct hands-on experiments to optimize performance, cost, and throughput of wafer fabrication processes such as wafer grinding, cleaning, and related metrology tools
  • Develop a deep understanding of a variety of semiconductor processing tools in order to help assist the production team with troubleshooting, maintenance and training
  • Work with third party vendors to continually evaluate and stay up-to-date on industry best-practices
  • Work creatively and cross-functionally with other teams at Halo to develop novel wafer fabrication techniques
  • Analyze production data from metrology tools to monitor and improve wafer defectivity and geometry
  • Collect, summarize and present results to other team members

Requirements

Preferred Education & Experience

  • The ideal candidate is a recent MS or PhD with 3+ years of relevant experience (or BS with 5+ years of relevant experience) in engineering, science or a related discipline. Candidates with higher levels of experience are also welcome to apply.

What We re Looking For

  • Outstanding detail-oriented analytical, creative, and problem-solving skills, with the ability to think critically to diagnose issues and optimize complex processes
  • Excellent understanding of and intuition for physical processes, both mechanical and chemical
  • Experience operating technically complicated production or laboratory equipment
  • Familiarity with various metrology tools and optical inspection techniques
  • Excellent communication skills and the ability to work effectively within an interdisciplinary team
  • Ability to manage multiple priorities with a proactive can do attitude

Bonus

  • Direct hands-on experience with wafer edge grinding equipment
  • Strong programming and data analysis skills using a language such as Python or Matlab or software such as JMP or Minitab
  • Experience with statistical process control in a high-precision manufacturing environment
  • Experience with design-of-experiment methodology

Benefits

  • $130-150k Base Salary
  • Health Care Plan (Medical, Dental & Vision)
  • Retirement Plan (401k, IRA)
  • Paid Time Off (Vacation, Sick & Public Holidays)
  • Family Leave (Maternity, Paternity)
  • Stock Option Plan
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
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