PCB Layout Engineer
Exciting opportunity for an experienced Principal PCB & Substrate Layout Engineer to join a growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation's defense.
The successful candidate will be part of a dynamic team that is transforming the business and the defense-grade microelectronics industry while executing on near-term program commitments while fostering a culture of teamwork and agility.
You will be responsible for:
Providing technical leadership to the engineering team specifically focused on High-Speed Interfaces and High Density Substrates layout techniques and understanding and improving the layout development processes to ensure we produce quality products using your expertise in PCB and Substrate layout engineering.
location: Phoenix, Arizona
job type: Contract
salary: $60 - 70 per hour
work hours: 8am to 5pm
education: Bachelors
responsibilities:
- Driving design, layout, and analysis of complicated electrical and mechanical systems and their constituent parts including: high-density interposers, substrates, and printed circuit board (PCB) layouts. This includes power, digital, analog, and RF signals across multiple die (primarily flip-chip)
- Hands on high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc.
- Understand Design For Manufacturing rules of our suppliers and ensure design process matches their capabilities
- Understand and provide fabrication drawings that match the intent of the design and support the fabrication suppliers to ensure the technical intent is transferred successfully
- Support package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant
- Work with peers and the engineering team to review the artwork and drawings at different stages and at the final design review for fabrication and assembly
- Provide support for multidisciplinary investigations and feasibility studies with collaboration across engineering disciplines
- Provide Technical guidance for interfacing to customers, subcontractors, assemblers, fabricators, and vendors/suppliers, operations, quality, supply chain, and supporting organizations
- Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors
- Considers the effects of actions on the system as a whole, i.e. "systems-thinking"
- Willing to help the team in areas outside of specific technical discipline to accomplish goals
qualifications:
- Minimum Education: Bachelor's Degree in Engineering or equivalent education and experience required
- Minimum Experience: 10+ years as a PCB and/or High-Density Package Layout designer using industry standard layout tools like Cadence APD+
skills:
- Experience with APD+ physical and electrical constraint editor
- HDI stack-ups, including use of blind & buried micro-vias, specialty RF dielectric materials, and trace width/spacing around 15um/15um down to 2um/2um or below
- Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, substrate stacking and other techniques
- Experience using a Cadence schematic / netlist driven CAD layout process, e.g. Cadence APD+ ( Allegro ) and supporting tools
- High-end FPGA package or board design experience
- Ability to work with our Mechanical team to design full 3D models for fit checks and thermal
- Understanding of layout techniques in Digital, Analog, and/or RF layouts
- Knowledge of electronic packaging techniques
- Experience using a CAM package for manufacturing data validation. Knowledge of CAM350 & Blueprint is preferred
- Working knowledge of JEDEC /IPC design, fabrication, and assembly specifications
- Experience creating assembly documentation and fabrication deliverables per company and industry standards
- Must be a US Person
- Work effectively individually and as part of a team
- Embrace the company culture that includes the following values and behaviors:
- Teamwork, execution, and communication
Equal Opportunity Employer: Race, Color, Religion, Sex, Sexual Orientation, Gender Identity, National Origin, Age, Genetic Information, Disability, Protected Veteran Status, or any other legally protected group status.
At Randstad Digital, we welcome people of all abilities and want to ensure that our hiring and interview process meets the needs of all applicants. If you require a reasonable accommodation to make your application or interview experience a great one, please contact
Pay offered to a successful candidate will be based on several factors including the candidate's education, work experience, work location, specific job duties, certifications, etc. In addition, Randstad Digital offers a comprehensive benefits package, including health, an incentive and recognition program, and 401K contribution (all benefits are based on eligibility).
This posting is open for thirty (30) days.
It is unlawful in Massachusetts to require or administer a lie detector test as a condition of employment or continued employment. An employer who violates this law shall be subject to criminal penalties and civil liability.
Exciting opportunity for an experienced Principal PCB & Substrate Layout Engineer to join a growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation's defense.
The successful candidate will be part of a dynamic team that is transforming the business and the defense-grade microelectronics industry while executing on near-term program commitments while fostering a culture of teamwork and agility.
You will be responsible for:
Providing technical leadership to the engineering team specifically focused on High-Speed Interfaces and High Density Substrates layout techniques and understanding and improving the layout development processes to ensure we produce quality products using your expertise in PCB and Substrate layout engineering.
location: Phoenix, Arizona
job type: Contract
salary: $60 - 70 per hour
work hours: 8am to 5pm
education: Bachelors
responsibilities:
- Driving design, layout, and analysis of complicated electrical and mechanical systems and their constituent parts including: high-density interposers, substrates, and printed circuit board (PCB) layouts. This includes power, digital, analog, and RF signals across multiple die (primarily flip-chip)
- Hands on high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc.
- Understand Design For Manufacturing rules of our suppliers and ensure design process matches their capabilities
- Understand and provide fabrication drawings that match the intent of the design and support the fabrication suppliers to ensure the technical intent is transferred successfully
- Support package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant
- Work with peers and the engineering team to review the artwork and drawings at different stages and at the final design review for fabrication and assembly
- Provide support for multidisciplinary investigations and feasibility studies with collaboration across engineering disciplines
- Provide Technical guidance for interfacing to customers, subcontractors, assemblers, fabricators, and vendors/suppliers, operations, quality, supply chain, and supporting organizations
- Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors
- Considers the effects of actions on the system as a whole, i.e. "systems-thinking"
- Willing to help the team in areas outside of specific technical discipline to accomplish goals
qualifications:
- Minimum Education: Bachelor's Degree in Engineering or equivalent education and experience required
- Minimum Experience: 10+ years as a PCB and/or High-Density Package Layout designer using industry standard layout tools like Cadence APD+
skills:
- Experience with APD+ physical and electrical constraint editor
- HDI stack-ups, including use of blind & buried micro-vias, specialty RF dielectric materials, and trace width/spacing around 15um/15um down to 2um/2um or below
- Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, substrate stacking and other techniques
- Experience using a Cadence schematic / netlist driven CAD layout process, e.g. Cadence APD+ ( Allegro ) and supporting tools
- High-end FPGA package or board design experience
- Ability to work with our Mechanical team to design full 3D models for fit checks and thermal
- Understanding of layout techniques in Digital, Analog, and/or RF layouts
- Knowledge of electronic packaging techniques
- Experience using a CAM package for manufacturing data validation. Knowledge of CAM350 & Blueprint is preferred
- Working knowledge of JEDEC /IPC design, fabrication, and assembly specifications
- Experience creating assembly documentation and fabrication deliverables per company and industry standards
- Must be a US Person
- Work effectively individually and as part of a team
- Embrace the company culture that includes the following values and behaviors:
- Teamwork, execution, and communication
Equal Opportunity Employer: Race, Color, Religion, Sex, Sexual Orientation, Gender Identity, National Origin, Age, Genetic Information, Disability, Protected Veteran Status, or any other legally protected group status.
At Randstad Digital, we welcome people of all abilities and want to ensure that our hiring and interview process meets the needs of all applicants. If you require a reasonable accommodation to make your application or interview experience a great one, please contact
Pay offered to a successful candidate will be based on several factors including the candidate's education, work experience, work location, specific job duties, certifications, etc. In addition, Randstad Digital offers a comprehensive benefits package, including health, an incentive and recognition program, and 401K contribution (all benefits are based on eligibility).
This posting is open for thirty (30) days.
It is unlawful in Massachusetts to require or administer a lie detector test as a condition of employment or continued employment. An employer who violates this law shall be subject to criminal penalties and civil liability.