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Hardware Design Engineer

Salary undisclosed

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Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
Familiarity with image sensors and camera modules would be a plus
7-10 years' of experience in hands-on Package/Module/PCB design
BS/MS/equivalent experience in engineering; PhD preferred

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
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Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
Familiarity with image sensors and camera modules would be a plus
7-10 years' of experience in hands-on Package/Module/PCB design
BS/MS/equivalent experience in engineering; PhD preferred

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
Report this job