SMTS/DMTS in Package Design

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Join the Package Development Engineering organization as a technical leader in the Global Design, Simulations, & Substrate group responsible for driving chip package interaction (CPI) packaging design rules and test vehicle strategies to support product development and NPI needs for flip chip products on advanced process nodes. This role offers an outstanding opportunity to work with Micron's leading technologists developing products for Data Center, Cloud, High Performance Computing, and AI solutions, collaborating with talented teams to deliver flawless and innovative memory and systems level product solutions.

Responsibilities will include, but are not limited to:

• Logic, DRAM, and Graphic flip chip package interaction (CPI) design rule owner covering relevant Fab BEOL, Substrate, and Assembly rules driving package design, substrate engineering, and package simulation
• Provide technical direction for definition of test vehicles needed for Logic, DRAM, and GDDR flip chip memory products on advanced fab process nodes.
• Partner with package/Si design, product architecture, CPI contacts in package technology, fab far backend development, foundry engineering, product engineering, and quality engineering to provide CPI risk assessment and mitigation strategies to meet cost, yield, and reliability performance goals.
• Support package architecture definition for advanced packaging projects as needed
• Drive development of technical packaging solutions with package design and technology development partners to recommend the optimum design criteria to meet electrical, mechanical, thermal, and other system level requirements. Introduce novel solutions at appropriate points to enable these solutions.
• EFA and PFA support as needed to debug CPI related failures, identify root cause, and implement design solutions
• Collaborate with strategic customers as required to ensure that package solutions can meet product roadmap requirements

Required Qualifications:

• Bachelor's degree or higher in Materials, Mechanical, Chemical, or Electrical Engineering.
• 12-15 years of experience
• Experience with flip chip assembly, flip chip package interactions, and 1st level chip interconnect reliability
• Shown leadership experience in guiding multi-functional teams and driving technical perfection.
• Proven track record to drive packaging roadmaps, engage vendors and suppliers, and support business unit leaders in customer engagements.
• Excellent interpersonal skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners.

Preferred Qualifications:

• Advanced knowledge of substrate fabrication technologies and materials
• Strong record of patent submissions and publications
• 15+ years of experience preferred.
• A strong network with colleagues in the industry and connections with key collaborators.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at or 1- (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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